Important Dates and Notices

Paper Submission Deadline: April 16, 2018

New Submission Deadline: April 30, 2018

Notification of Acceptance: May 14, 2018 

Final Paper Submission: June 01, 2018 

Conference Date:  July 16-18, 2018 








One of the largest art fairs in US

July 19-22, 2018

General Information

IMWS-AMP 2018 conference represents a unique and unprecedented opportunity to bring together researchers and practitioners of different background (materials scientists, chemical experts, physicists, microwave engineers and process technologists), to share the most recent advances in new materials and manufacturing processes, which represent the key for the development of future RF, microwave, mm-wave and THz devices, circuits and systems. IMWS-AMP 2018 is organized by the IEEE Microwave Theory and Techniques Society (MTT-S) with the technical co-sponsorship of the European Microwave Association (EuMA). The conference will feature an exciting technical program, an industry exhibit, and invited talks by worldwide recognized experts in materials and manufacturing processes.

Ann Arbor, Michigan, USA

Ann Arbor is a city west of Detroit, in the Midwestern state of Michigan. It’s home to the sprawling University of Michigan, known for its research programs. The University of Michigan Museum of Art displays works from around the globe and spanning centuries. Science-focused attractions in the city include the Museum of Natural History and the Ann Arbor Hands-On Museum, with kid-friendly interactive exhibits. The city's economy is centered on high technology, with several companies drawn to the area by the university's research and development infrastructure, and by its graduates. Several performing arts groups and facilities are on the University of Michigan's campus, as are museums dedicated to art, archaeology, and natural history and sciences. Ann Arbor has a typically Midwestern humid continental climate.

 

 

Call for Papers

The purpose of IMWS-AMP 2018 is to boost technical and educational activities as well as exchanges and collaborations within the international microwave community. Perspective authors are cordially invited to submit papers in all areas of novel material, advanced manufacturing and processing, and integration techniques for microwave to terahertz circuits and system.

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