Call for Papers

The IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes 2018 (IMWS-AMP 2018) conference represents a unique and unprecedented opportunity to bring together researchers and practitioners of different background (materials scientists, chemical experts, physicists, microwave engineers and process technologists), to share the most recent advances in new materials and manufacturing processes, which represent the key for the development of future RF, microwave, mm-wave and THz devices, circuits and systems. IMWS-AMP 2018 is organized by the IEEE Microwave Theory and Techniques Society (MTT-S) with the technical co-sponsorship of the European Microwave Association (EuMA). The conference will feature an exciting technical program, an industry exhibit, and invited talks by worldwide recognized experts in materials and manufacturing processes.



Conference Topics

Perspective authors are cordially invited to submit papers in all areas of novel material, advanced manufacturing and processing, and integration techniques for microwave to terahertz circuits and systems, including but not limited to:  

  • RF, microwave and THz components and circuits based on new materials 1
  • Advanced manufacturing processes
  • Additive manufacturing & 3D-printing
  • Wearable components and antennas
  • Organic RF electronics and devices
  • Components based on inkjet printing
  • Smart and functional materials
  • Sensor technologies
  • Artificial and engineered materials
  • Microwave devices based on semiconductor materials
  • Nanomaterials (e.g., graphene, CNT)
  • High-speed memory materials
  • Bio-materials
  • Multiphysics modeling
  • Material characterization
  • Integration and interconnect technologies

Submitted papers should be three pages in length. Authors must adhere to the format of the IEEE conference paper template



Important Dates

Submission deadline: April 16, 2018
New Submission deadline: April 30, 2018
Notification of Acceptance: May 14, 2018
Final Paper Submission: June 01, 2018
Conference Dates: July 16-18, 2018

 

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